电子设备用带模压载体环的片式载体封装烧进插座的空白详细规范 

Provides all information required for the identification and quality assessment of the burn-in sockets for chip carrier packages with molded carrier rings...
ANSI  国外标准  1993年 下载次数(0)| 被引次数(0)

Effects of puerarin on burn injury pain mediated by P2X_3 receptor 

Objective Peripheral administration of P2X agonists rapidly causes nocifensive behavior in experimental animals and pain sensation in humans.Most of the noci...
中国神经科学学会第九届全国学术会议暨第五次会员代表大…  2011-07-29 下载次数(5)| 被引次数(0)

电子设备用球形格栅阵列(BGA)器件烧接插座的空白详细规范 

Provides specifications for ball grid array (BGA) burn-in sockets of assessed quality having a maximum enclosure (maximum length, width and height dimensi...
ANSI  国外标准  2000年 下载次数(0)| 被引次数(0)

电子设备用带模制垫圈的片载插件用焊上插孔的空白详细规范 

Provides all information required for the identification and quality assessment of the burn-in sockets for chip carrier packages with molded carrier rings...
EIA  国外标准  1993年 下载次数(0)| 被引次数(0)

电子设备用带模制垫圈的片载插件用焊上插孔的空白详细规范.注:ANSI/EIA 540GA00-1993的再确认2001-04-06、1993-08-10批准 

Provides all information required for the identification and quality assessment of the burn-in sockets for chip carrier packages with molded carrier rings...
  国外标准  1993年 下载次数(0)| 被引次数(0)

电子设备用的球形格子排列装置的焊上插孔的空白详细规范 

Provides specifications for ball grid array (BGA) burn-in sockets of assessed quality having a maximum enclosure (maximum length, width and height dimensi...
EIA  国外标准  2000年 下载次数(0)| 被引次数(0)